Impact of via-line contact on CU interconnect electromigration performance.
| Autor: | Baozhen Li, Gill, J., Christiansen, C.J., Sullivan, T.D., McLaughlin, P.S. |
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| Zdroj: | 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings 43rd Annual; 2005, p24-30, 7p |
| Databáze: | Complementary Index |
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