Fracture behaviour of flip chip solder joints.
| Autor: | Wiese, S., Jakschik, S., Feustel, F., Meusel, E. |
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| Zdroj: | 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p1299-1306, 8p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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