Creep behavior of a molding compound and its effect on packaging process stresses.
| Autor: | Kiasat, M.S., Zhang, G.Q., Ernst, L.J., Wisse, G. |
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| Zdroj: | 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p931-938, 8p |
| Databáze: | Complementary Index |
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