Advanced thermal interface materials for enhanced flip chip BGA.
| Autor: | Kohli, P., Sobczak, M., Bowin, J., Matthews, M. |
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| Zdroj: | 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p564-570, 7p |
| Databáze: | Complementary Index |
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