On the effect of system constraints on mechanical integrity of high density packages used in telecommunication applications.
| Autor: | Langari, A.R., Morris, W.L., Kuhlman, M., Hashemi, H.S., Dadkhah, M.S. |
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| Zdroj: | 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p264-269, 6p |
| Databáze: | Complementary Index |
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