A high performance drying method enabling clustered single wafer wet cleaning.
Autor: | Mertens, P.W., Doumen, G., Lauerhaas, J., Kenis, K., Fyen, W., Meuris, M., Arnauts, S., Devriendt, K., Vos, R., Heyns, M. |
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Zdroj: | 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104); 2000, p56-57, 2p |
Databáze: | Complementary Index |
Externí odkaz: |