A high performance drying method enabling clustered single wafer wet cleaning.

Autor: Mertens, P.W., Doumen, G., Lauerhaas, J., Kenis, K., Fyen, W., Meuris, M., Arnauts, S., Devriendt, K., Vos, R., Heyns, M.
Zdroj: 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104); 2000, p56-57, 2p
Databáze: Complementary Index