Under bump metallurgies for a wafer level CSP with eutectic Pb-Sn solder ball.
| Autor: | Soon-Jin Cho, Ji-Yon Kim, Myung-Geun Park, Ik-Sung Park, Heung-Sup Chun |
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| Zdroj: | 2000 Proceedings 50th Electronic Components & Technology Conference (Cat. No.00CH37070); 2000, p844-849, 6p |
| Databáze: | Complementary Index |
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