Module packaging for high-speed serial and parallel transmission.
| Autor: | Karstensen, H., Auracher, F., Ebel, N., Fiedler, J., Plickert, V., Melchior, L., Leininger, L., Bittner, M., Festag, M., Wicke, M., Meyer, S., Miller, R., Kuhn, G., Althaus, H.-L., Ebberg, A. |
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| Zdroj: | 2000 Proceedings 50th Electronic Components & Technology Conference (Cat. No.00CH37070); 2000, p479-486, 8p |
| Databáze: | Complementary Index |
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