Transient fuse structures: The role of metal etching vs. dielectric deposition.
Autor: | Gabriel, C.T., Kim, R.Y. |
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Zdroj: | 2000 5th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.00TH8479); 2000, p168-171, 4p |
Databáze: | Complementary Index |
Externí odkaz: |