A new void free soldering process in large-area, high power IGBT modules.
| Autor: | Onuki, J., Chonan, Y., Komiyama, T., Nihei, M., Saitou, R., Suwa, M., Kitano, M. |
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| Zdroj: | 12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094); 2000, p367-370, 4p |
| Databáze: | Complementary Index |
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