Silver diamond composite as a new packaging solution: A thermo-mechanical stability study.
| Autor: | Faqir, M., Batten, T., Mrotzek, T., Knippscheer, S., Massiot, M., Letteron, L., Rochette, S., Vendier, O., Desmarres, J.M., Courtade, F., Kuball, M. |
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| Zdroj: | 2011 27th Annual IEEE Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM); 2011, p314-316, 3p |
| Databáze: | Complementary Index |
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