Suppression of the corner effects in a 22 nm hybrid Tri-Gate/planar process.
| Autor: | Baldauf, T., Wei, A., Herrmann, T., Flachowsky, S., Illgen, R., Hontschel, J., Horstmann, M., Klix, W., Stenzel, R. |
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| Zdroj: | 2011 Semiconductor Conference Dresden (SCD); 2011, p1-4, 4p |
| Databáze: | Complementary Index |
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