Interconnect processes and reliability for RF technology.
| Autor: | Gambino, J.P., Anderson, F., Cooney, E., He, J., Bolam, R., Webb, B.C., Cabral, C., Shaw, T., Vanslette, D. |
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| Zdroj: | 2011 18th IEEE International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA); 2011, p1-11, 11p |
| Databáze: | Complementary Index |
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