Prospects of 3D inductors on through silicon vias processes for 3D ICs.
| Autor: | Bontzios, Y.I., Dimopoulos, M.G., Hatzopoulos, A.A. |
|---|---|
| Zdroj: | 2011 IEEE/IFIP 19th International Conference on VLSI & System-on-Chip (VLSI-SoC); 2011, p90-93, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|