Modelling aluminium wire bond reliability in high power OMP devices.
| Autor: | Kregting, R., Yuan, C., An Xiao, de Bruijn, F. |
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| Zdroj: | 2011 12th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2011, p1/4-4/4-4/4, 1p |
| Databáze: | Complementary Index |
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