Silicon-die thermal monitoring using embedded sensor cells unit.

Autor: Sayde, M., Berriah, O., Lakhssassi, A., Bougataya, M., Kengne, E., Talbi, L.
Zdroj: 2011 IEEE 9th International New Circuits & Systems Conference (NEWCAS); 2011, p153-156, 4p
Databáze: Complementary Index