High-performance metal hard mask process using novel TiN film for 32-nm node Cu interconnect and beyond.
| Autor: | Torazawa, N., Hinomura, T., Harada, T., Kabe, T., Inagaki, D., Morinaga, Y., Shibata, J., Shigetoshi, T., Hazue, S., Motojima, D., Matsumoto, S., Kishida, T. |
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| Zdroj: | Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International; 2011, p1-3, 3p |
| Databáze: | Complementary Index |
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