Photo-imageable spin-on dielectrics for TSV 3D packaging applications.
| Autor: | Zhang, R.M., Chien-Hsien Sam Lee, Wolfer, E., Nagahara, T. |
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| Zdroj: | Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International; 2011, p1-3, 3p |
| Databáze: | Complementary Index |
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