Effects of combined thermal and vibration loadings on the wire bond integrity.
| Autor: | Kamaludin, K.A., Mirgkizoudi, M., Liu, C., Riches, S. |
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| Zdroj: | 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2011, p1-4, 4p |
| Databáze: | Complementary Index |
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