Process optimization approach in fine pitch Cu wire bonding.
| Autor: | Wong, B.K., Yong, C.C., Eu, P.L., Yap, B.K. |
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| Zdroj: | 2011 International Conference on Electronic Devices, Systems & Applications (ICEDSA); 2011, p147-151, 5p |
| Databáze: | Complementary Index |
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