Delamination toughness of Cu-EMC interfaces at harsh environment.
| Autor: | Sadeghinia, M., Jansen, K.M.B., Ernst, L.J., Schlottig, G., Pape, H. |
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| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1976-1980, 5p |
| Databáze: | Complementary Index |
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