Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding.
| Autor: | Pham, N.P., Cherman, V., Vandevelde, B., Limaye, P., Tutunjyan, N., Jansen, R., Van Hoovels, N., Tezcan, D.S., Soussan, P., Beyne, E., Tilmans, H.A.C. |
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| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1588-1595, 8p |
| Databáze: | Complementary Index |
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