Design and reliability analysis of pyramidal shape 3-layer stacked TSV die package.
| Autor: | Che, F.X., Chai, T.C., Lim, S.P.S., Rajoo, R., Xiaowu Zhang |
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| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1428-1435, 8p |
| Databáze: | Complementary Index |
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