A novel compact antenna with a low profile demonstrated on embedded wafer level packaging (EMWLP) technology.
| Autor: | Lim Ying Ying, David, H.S.W., Chong Ser Choong, Myo Ei Pa Pa, Lim Teck Guan |
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| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1354-1362, 9p |
| Databáze: | Complementary Index |
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