Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultra thin device.
| Autor: | Xiaowu Zhang, Rajoo, R., Selvanayagam, C.S., Kumar, A., Rao, V.S., Khan, N., Kripesh, V., Lau, J.H., Kwong, D.-L., Sundaram, V., Tummula, R.R. |
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| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1276-1282, 7p |
| Databáze: | Complementary Index |
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