Thin gold to gold bonding for flip chip applications.
| Autor: | Rohwer, L.E.S., Dahwey Chu |
|---|---|
| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p907-910, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Rohwer, L.E.S., Dahwey Chu |
|---|---|
| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p907-910, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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