Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints.
| Autor: | Deng, W.J., Lin, K.L., Chiu, Y.T., Lai, Y.S. |
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| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p114-117, 4p |
| Databáze: | Complementary Index |
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