Reliability evaluation on low k wafer level packages.
| Autor: | Yadav, P., Kalchuri, S., Keser, B., Zang, R., Schwarz, M., Stone, B. |
|---|---|
| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p71-77, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|