Thermal budget reduction and throughput enhancement for CMOS Epi stressors via wet clean interface contamination evaluation and control.
Autor: | Brabant, P., Chung, K., Shinriki, M., Hasaka, S., Scott, D., Wirzbicki, M., Francis, T., Hong He, Sadana, D.K. |
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Zdroj: | Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI; 2011, p1-3, 3p |
Databáze: | Complementary Index |
Externí odkaz: |