On the technology and ecosystem of 3D / TSV manufacturing.
| Autor: | Hummler, K., Smith, L., Caramto, R., Edgeworth, R., Olson, S., Pascual, D., Qureshi, J., Rudack, A., Quon, R., Arkalgud, S. |
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| Zdroj: | Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI; 2011, p1-6, 6p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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