Reliability of lead-free solder interconnects-a review.
| Autor: | Tonapi, S., Gopakumar, S., Borgesen, P., Srihari, K. |
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| Zdroj: | 2002 Proceedings Annual Reliability & Maintainability Symposium (Cat. No.02CH37318); 2002, p423-428, 6p |
| Databáze: | Complementary Index |
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