Interconnect modeling for copper/low-k technologies.
| Autor: | Nagaraj, N.S., Bonifield, T., Singh, A., Griesmer, R., Balsara, P. |
|---|---|
| Zdroj: | Proceedings of the 17th International Conference on VLSI Design; 2004, p425-427, 3p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|