Studies on SEE Characteristic and Hardening Techniques of CMOS SRAM with Sub-micro Feature Sizes.

Autor: Xing-hua, He, Cong, Zhang, Yong-liang, Zhang, Huan-zhang, Lu
Zdroj: Advanced Techniques in Computing Sciences & Software Engineering; 2010, p191-196, 6p
Abstrakt: The single event effects (SEE) characteristic and hardening techniques of CMOS SRAM with sub-micron feature size are studied in the paper. After introducing the relationship SEE with the structure of memory cell, the rate of read-write, the feature sizes and the power supply, the SEE hardening techniques for the COMS SRAM are given from tow aspect: device-level hardening techniques and system-level hardening techniques. Finally, an error detection and correction (EDAC) design based on high reliability anti-fused FPGA is presented, this design has special real-time performance and high reliability, and has been adopted in a space-bone integrated processor platform, which works well in all kinds of environmental experiments. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index