A Road map of 2.5-D Integration.

Autor: Deng, Yangdong Steve, Maly, Wojciech P.
Zdroj: 3-Dimensional VLSI; 2010, p144-163, 20p
Abstrakt: In this chapter we propose a roadmap for the development of 2.5-D integrated VLSI systems. Beginning with relatively simple stacked memory chips, we envision that the 2.5-D paradigm will be gradually adopted by CPUs, graphic processors, mixed-signal systems, and extremely highperformance applications. The 2.5-D technology would unleash the power to build VLSI applications that are hard to imagine today. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index