Stress distribution in an aluminum interconnect of very large scale integration.

Autor: Niwa, H., Yagi, H., Tsuchikawa, H., Kato, Masaharu
Předmět:
Zdroj: Journal of Applied Physics; 7/1/1990, Vol. 68 Issue 1, p328, 6p
Abstrakt: Deals with a study which evaluated stresses in the aluminum line integrated circuit using a proposed method in micromechanics. Calculation of stresses in the line; Stresses after complete relaxation; Discussion of relaxation by plastic deformation.
Databáze: Complementary Index