Diffusional relaxation and void growth in an aluminum interconnect of very large scale integration.
| Autor: | Kato, Masaharu, Niwa, H., Yagi, H., Tsuchikawa, H. |
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| Zdroj: | Journal of Applied Physics; 7/1/1990, Vol. 68 Issue 1, p334, 5p |
| Abstrakt: | Discusses the diffusional relaxation of grain-boundary voids in an aluminum line. Discussion of relaxation by diffusion; Comparison with experimental results. |
| Databáze: | Complementary Index |
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