| Autor: |
Fang, Y., Danyluk, S., Cha, Y. S., Lanagan, M. T. |
| Předmět: |
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| Zdroj: |
Journal of Applied Physics; 1/15/1996, Vol. 79 Issue 2, p947, 6p, 2 Diagrams, 2 Charts, 5 Graphs |
| Abstrakt: |
Presents a study that calculated current and voltage distributions in Ag/Bi[sub2]Sr[sub2]Cu[subn]O[sub2n+4 (BSCCO) composites from an analytical model that is based on interfacial and geometric parameters. Diagram of current and voltage lead placement in Ag/Bi-2223; Comparison of interfacial resistivity and voltage drop across the interface; Analysis of the effects of cracks on critical current density for powder-in-tube tape. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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