In-vacuum cleaving and coating of semiconductor laser facets using thin silicon and a dielectric.

Autor: Tu, L. W., Schubert, E. F., Hong, M., Zydzik, G. J.
Předmět:
Zdroj: Journal of Applied Physics; 12/1/1996, Vol. 80 Issue 11, p6448, 4p, 2 Diagrams, 4 Graphs
Abstrakt: Proposes an approach to the coating of semiconductor laser facets, using thin silicon (Si) and band gap dielectric layers. Consequences of the formation of electronic states at the semiconductor surface; Description of the layer sequence and band diagram of the gallium arsenide/α-Si/ Al[sub2]O[sub3] coating; Information on several methods of hydrogen passivation.
Databáze: Complementary Index