Physical damage in silicon formed by helicon wave plasma etching.

Autor: Tsukada, Tsutomu, Nogami, Hiroshi, Hayashi, Jun, Kawaguchi, Kazu, Hara, Tohru
Předmět:
Zdroj: Journal of Applied Physics; 11/1/1993, Vol. 74 Issue 9, p5402, 4p, 7 Graphs
Abstrakt: Presents a study which examined the physical damage formed on silicon by helicon wave oxygen plasma. Experimental procedures used; Analysis of the origin of damage density variations; Factor that contributed to the increase in damage density.
Databáze: Complementary Index