| Autor: |
Arcot, B., Murarka, S. P., Clevenger, L. A., Hong, Q. Z., Ziegler, W., Harper, J. M. E. |
| Předmět: |
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| Zdroj: |
Journal of Applied Physics; 11/1/1994, Vol. 76 Issue 9, p5161, 10p, 1 Black and White Photograph, 2 Diagrams, 13 Graphs |
| Abstrakt: |
Investigates the interactions in copper and magnesium thin films leading to the growth of Cu[sub2]Mg and CuMg[sub2] intermetallics. Techniques used in situ resistance measurements; Information on copper and magnesium; Analysis of the effect of exposing the reacting interfaces to controlled exposure of oxygen on the nucleation and growth kinetics of intermetallics. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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