Study of reactive-ion-etch-induced lattice damage in silicon by Ar, CF4, NF3, and CHF3 plasmas.

Autor: Connick, I-Wen H., Bhattacharyya, Anjan, Ritz, Kenneth N., Smith, W. Lee
Předmět:
Zdroj: Journal of Applied Physics; 8/15/1988, Vol. 64 Issue 4, p2059, 5p
Abstrakt: Presents information on a study which investigated reactive-ion-etch-induced damage in silicon. Preparation of wafers for oxide leakage current measurements; Results of transmission electron microscopy; Thermal wave results.
Databáze: Complementary Index