Mechanisms of interdiffusion in copper/nickel thin-film couples.

Autor: Johnson, B. C., Bauer, C. L., Jordan, A. G.
Předmět:
Zdroj: Journal of Applied Physics; 2/15/1986, Vol. 59 Issue 4, p1147, 9p, 1 Black and White Photograph, 1 Diagram, 11 Graphs
Abstrakt: Presents information on a study which examined the mechanisms of interdiffusion in copper/nickel thin film couples using in situ measurement of contact resistance. Experimental details; Determination of concentration profiles for all annealed couples; Conclusions.
Databáze: Complementary Index