Autor: |
Johnson, B. C., Bauer, C. L., Jordan, A. G. |
Předmět: |
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Zdroj: |
Journal of Applied Physics; 2/15/1986, Vol. 59 Issue 4, p1147, 9p, 1 Black and White Photograph, 1 Diagram, 11 Graphs |
Abstrakt: |
Presents information on a study which examined the mechanisms of interdiffusion in copper/nickel thin film couples using in situ measurement of contact resistance. Experimental details; Determination of concentration profiles for all annealed couples; Conclusions. |
Databáze: |
Complementary Index |
Externí odkaz: |
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