Noise measurements in thin-film interconnections: A nondestructive technique to characterize electromigration.

Autor: Bagnoli, P. E., Diligenti, A., Neri, B., Ciucci, S.
Předmět:
Zdroj: Journal of Applied Physics; 3/1/1988, Vol. 63 Issue 5, p1448, 4p, 1 Black and White Photograph, 1 Diagram, 5 Graphs
Abstrakt: Presents a study which conducted noise measurements to examine the electromigration in aluminum thin film interteconnections. Description of the measuring apparatus; Methodology; Results.
Databáze: Complementary Index