Effects of the addition of small amounts of Al to copper: Corrosion, resistivity, adhesion, morphology, and diffusion.
| Autor: | Ding, P. J., Lanford, W. A., Hymes, S., Murarka, S. P. |
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| Zdroj: | Journal of Applied Physics; 4/1/1994, Vol. 75 Issue 7, p3627, 5p, 1 Black and White Photograph, 5 Graphs |
| Abstrakt: | Presents a study which explored the properties of thin films of copper with small amounts of aluminum. Background on copper; Experimental procedure applied; Results. |
| Databáze: | Complementary Index |
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