In situ scanning electron microscopy observation of the dynamic behavior of electromigration voids in passivated aluminum lines.

Autor: Besser, Paul R., Madden, Michael C., Flinn, Paul A.
Předmět:
Zdroj: Journal of Applied Physics; 10/15/1992, Vol. 72 Issue 8, p3792, 6p
Abstrakt: Presents a study which examined the dynamic behavior of electromigration voids using a field-emission scanning electron microscope fitted with a Robinson backscatter detector. Formation, growth and motion of electromigration voids; Comparison of experimental results with void motion models.
Databáze: Complementary Index