| Autor: |
Shimbo, M., Furukawa, K., Fukuda, K., Tanzawa, K. |
| Předmět: |
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| Zdroj: |
Journal of Applied Physics; 10/15/1986, Vol. 60 Issue 8, p2987, 3p |
| Abstrakt: |
Discusses the occurrence of strong bonding when a pair of clean, mirror-polished silicon surfaces are contacted at room temperature after hydrophilic surface formation. Application of thermic infrared rays transmitted through the bonded wafer for imaging voids; Evaluation of electric resistance for the bonded wafer; Fracture strength for the bonded silicon in relation to heating temperature. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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