Stress-Induced Voiding.
| Autor: | Tewksbury, Stuart K., Brewer, Joe E., Strong, Alvin W., Wu, Ernest Y., Vollertsen, Rolf-Peter, Suñé, Jordi, La Rosa, Giuseppe, Rauch, Stewart E., Sullivan, Timothy D. |
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| Zdroj: | Reliability Wearout Mechanisms in Advanced CMOS Technologies; 2009, p517-564, 48p |
| Databáze: | Complementary Index |
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