TEM in Under Bump Metallization (UBM) and Advanced Electronics Packaging Technologies.
| Autor: | Tung, Chih-Hang, Sheng, George T. T., Lu, Chih-Yuan |
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| Zdroj: | ULSI Semiconductor Technology Atlas; 2003, p558-608, 51p |
| Databáze: | Complementary Index |
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