Mapping of wafer profile to plasma processing conditions: Forward and reverse maps.

Autor: Lane, Jennifer, Rietman, Edward A., Layadi, Nace, Lee, John T. C.
Zdroj: Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 2000, Vol. 18 Issue 1, p299-302, 4p
Databáze: Complementary Index