Mapping of wafer profile to plasma processing conditions: Forward and reverse maps.
Autor: | Lane, Jennifer, Rietman, Edward A., Layadi, Nace, Lee, John T. C. |
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Zdroj: | Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 2000, Vol. 18 Issue 1, p299-302, 4p |
Databáze: | Complementary Index |
Externí odkaz: |