Improving pattern placement using through-the-membrane signal monitoring.

Autor: Perkins, F. K., Marrian, C. R. K., Peckerar, M. C.
Zdroj: Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 1998, Vol. 16 Issue 6, p3567-3571, 5p
Databáze: Complementary Index